Eyeq4 Datasheet Work

The full-capability version designed for surround-view systems and trifocal front-sensing. It processes information from multiple cameras, radars, and lidars to create a "safety cocoon" around the vehicle.

The EyeQ4 is frequently chosen by major automotive Tier-1 suppliers and OEMs for its safety-critical capabilities.

This deep-dive guide extracts and breaks down the core technical parameters found within an , shedding light on its heterogeneous architecture, processing variants, and implementation in modern automotive platforms. 🛠 Core Technical Specifications Overview eyeq4 datasheet

Up to 2.5 Tera Operations Per Second (TOPS) .

Below is the technical breakdown and functional specifications typically found in an . 核心规格 (Key Specifications) This deep-dive guide extracts and breaks down the

This efficiency is further supported by sophisticated power management ICs (PMICs) from partners like Texas Instruments and NXP. For example, TI's LP875701-Q1 and LP875761-Q1 PMICs are specifically designed to power the EyeQ4's 1.0V digital core rail, delivering up to 10A and 16A respectively, while meeting stringent automotive voltage accuracy requirements. NXP provides similar solutions using its PF5020 and PF5024 functional safety PMICs.

The table below summarizes the key technical specifications of the EyeQ4. and applications of the EyeQ4

The EyeQ4 datasheet is a comprehensive document that provides an in-depth look at the specifications, features, and applications of the EyeQ4, a system-on-chip (SoC) designed by Mobileye, a leading company in the field of autonomous driving and artificial intelligence (AI). The EyeQ4 is a fourth-generation SoC that enables advanced driver-assistance systems (ADAS) and autonomous driving capabilities in various industries, including automotive, industrial, and robotics.

| Parameter | Value | |--------------------------|----------------------------------| | Supply Voltage (core) | 0.9 V – 1.1 V | | I/O Voltage | 1.8 V / 3.3 V (configurable) | | Typical Power (TDP) | 3 W – 5 W (operational) | | Max Power | ~8 W (peak) | | Package Type | FCBGA (Flip-Chip Ball Grid Array)| | Operating Temp (junction)| -40°C to +125°C | | Interfaces | MIPI CSI-2, CAN, FlexRay, Automotive Ethernet, I2C, SPI, GPIOs, PCIe |

Six cores dedicated to complex visual processing.

A comparison of performance metrics between . Share public link